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Overview Block Diagram Solution Advantages Recommended SoC Development Resources

Overview

Smart home devices have long operated on separate wireless protocols — BLE, Zigbee, Thread and Matter. With Matter emerging as the unified industry standard, the market demands a interconnection hub: a single gateway that can access, connect and control multi-protocol devices.

Telink delivers a multi-protocol wireless coexistence solution for smart home gateways. Using a single multi-protocol wireless SoC as the wireless co-processor, it allows the main MCU to network and control BLE, Zigbee and Matter devices via a unified interface. One hardware platform manages multiple protocols. This single-chip design cuts costs and speeds up mass production. Telink provides reference designs and development tools to enable deployment.

Solution Advantages

01

Single multi-protocol SoC with integrated BLE, Zigbee and Matter protocol

02

Integrated solution for cost effective, suitable for gateways and nodes

03

Supports concurrent connection of BLE, Zigbee & Matter devices with separate control

04

Reference Design + Toolchain: including RCP firmware, node examples, Linux flashing & test tools for quick start

05

Local support accelerates product development and time-to-market

06

Open and easy to integrate

Recommended SoC

Development Resources

Picture Product Name Description User Manual Design Guideline Design File Mouser Digikey
TL323X EV-board

The TL3238X EVB is designed on the TL3238X SoC and is used to verify the TL323x series chips. It supports testing of various functions,making it easy for development and debugging.

Download Download Download
TL322X EV-board

The TL322X EV-board is designed based on the TL322X chip and and is used to verify the TL3228X/3828X series chips and supports various functional tests.

Download Download Download

Eager to evaluate our Reference Design quickly? Check out our official Get‑started guide.


Get full demo code, flashing guides and test demos for fast prototype validation, speeding up your product development.